Special Symposium - Packaging and Integration technologies for Optical MEMS/NEMS, Optoelectronic and Nanophotonic Devices (OMPP)

It is increasingly difficult to meet the high-bandwidth density, low-latency, and low-energy communication requirements of current and future terascale computing systems using conventional electrical interconnects. Optical devices and optical interconnects can overcome these limitations. A vast amount of work is being carried out in the development of optical interconnects, optical PCBs and chip-to-chip as well as on-chip optical interconnections. In order to reduce the footprint and cost of the optical interconnects, the size of the optical components needs to be reduced and more functionality must be integrated within one component. Silicon wire, plasmonic waveguides and photonic crystal structures are just examples of approaches to reach these goals.

Integration, packaging and coupling of these tiny structures to the external world, dominated by optical fiber, presents a challenge, especially since the solutions need to be cost effective and manufacturable. As optical packages become more compact and dense, new problems arise in reconciling the I/O bandwidth, power delivery and cooling needs. Papers are solicited on novel optical packaging, integration and microassembly technologies that will help overcome these challenges.

Committee Members: Sonia García-Blanco, Institute National d’Optique (INO), Québec, Canada, Karen Matthews, Corning Incorporated, USA, Muhannad Bakir, Georgia Tech, USA, Folkert Horst, IBM Zurich, Switzerland, Keishi Ohashi, NEC Nano Electronics Research Lab, Japan