Paper Submissions

7th International Conference on Group IV Photonics

Beijing, China | 1-3 September 2010

Post-Deadline Paper Deadline: 12.00, 1 September 2010

The IEEE International Conference on Group IV Photonics (GFP) represents a major international forum to present and discuss recent research advances of photonic devices and materials based on group IV elements, and highlights the developments in Silicon Photonics. GPF 2010 is the seventh in a series which began in Hong Kong in 2004, and was hosted in rotation among Europe, North America and Asia. GPF 2010 will be held in Beijing, the capital city and a cultural, educational and scientific center of China, from 1 to 3 September 2010.

Topics of GFP 2010 span from fundamental research in novel devices and materials to the developments of photonic circuits using monolithic or hybrid integration technologies. Applications range from optical interconnects and communications to biomedical sensing devices, from novel concepts in solar cells to optical micro electro-mechanical systems. Contributions are solicited on recent developments in group IV photonic devices operating at wavelengths within the wide spectrum ranging from the ultraviolet to the very far infrared (terahertz). The conference also encourages contributions that describe monolithic or hybrid integration of compound semiconductor structures upon silicon. The topics are organized in 3 sections: ‘Photonic Devices and Nanophotonics’, ‘Silicon Photonics Integration and Active Device Technologies’, and ‘Advanced Material and Fabrication Technologies’.

All colleagues interested in the recent progresses and future challenges are invited to participate in GFP 2010 and encouraged to submit their technical contributions.

Conference Co-Chairs

JinZhong Yu, Institute of Semiconductors, Chinese Academy of Sciences, China
Dan-Xia Xu, Institute for Microstructural Sciences, National Research Council, Canada

International Advisory Committee

Roel G. Baets, Ghent University/IMEC, Belgium
Philippe M. Fauchet, University of Rochester, USA
Siegfried Janz, NRC-Institute for Microstructural Sciences, Canada
Lionel C. Kimerling, MIT, USA
Thomas L. Koch, Lehigh University, USA
Mario Paniccia, Intel Corporation, USA
Lorenzo Pavesi, University of Trento, Italy
Albert Polman, FOM Center for Nanophotonics, The Netherlands
Gernot S. Pomrenke, AFOSR Office of Scientific Research, USA
Francesco Priolo, University of Catania, Italy
Jagdeep Shah, DARPA Microsystems Technology Office, USA
Jung Hoon Shin, KAIST, Korea
Richard Soref, US Air Force Research Laboratory, USA
Kazumi Wada, University of Tokyo, Japan
Kang L. Wang, University of California - Los Angeles, USA
Koji Yamada, NTT Microsystem Integration Laboratories, Japan
JinZhong Yu, Chinese Academy of Sciences, Beijing Institute of Semiconductors, China


Photonic Devices and Nanophotonics


Commercial Success of Silicon Photonics in Biosensing
Cary Gunn, Genalyte, Inc., USA

Monolithic Ge-on-Si Lasers for Integrated Photonics
Jifeng Liu, Massachusetts Institute of Technology, USA

Waveguides for Mid-Infrared Group IV Photonics
Goran Mashanovich, University of Surrey, UK

Silicon Nanophotonic Devices Based on Periodic
Zhiping Zhou, Peking University, China


Silicon Photonics Integration and Active Device Technologies


CMOS-Integrated High-Speed Germanium Waveguide-Photodetector with Ultra-Low Capacitance
Solomon Assefa, IBM TJ Watson Research Center, USA

Next Generation of Optical Integration – The Impact of CMOS Photonics
Dave D’Andrea, Lightwire, Inc. USA

Undertaking Research in the Field of Silicon Optical Modulators in the Framework of the Helios and UK Silicon Photonics Projects
Frederic Yannick Gardes, University of Surrey, UK

200mm Wafer Scale III-V/SOI Technology for All-Optical Network-on-Chip and Signal Processing
Liu Liu, Ghent University, Belgium


Topic: Advanced Material and Fabrication Technologies


Silicon based Solar Cells: Research Progress and Future Perspectives
Simona Binetti, University of Milano-Bicocca, Italy

Integration of Optical Devices based on Si, Ge and SiOx
Sei-ichi Itabashi, NTT Microsystem Integration Laboratories, Japan

Silicon-Organic Hybrid – A Solution for Next Generation Ultra-Compact, Ultra-Fast Active Photonics
Juerg Leuthold, Karlsruhe Institute of Technology

Electrically Pumped Random Lasing from ZnO Materials
Xiangyang Ma, Zhejiang University, China





Conference Administrator:

Megan Figueroa
Tel: +1 732 562 3895
Fax: +1 732 562 8434
m.figueroa@ieee.org
 

 

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